 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| INTEGRATED CIRCUITS DATA SHEET TDA9181 Integrated multistandard comb filter Objective specification File under Integrated Circuits, IC02 2000 Nov 22 Philips Semiconductors Objective specification Integrated multistandard comb filter FEATURES * One-chip multistandard adaptive comb filter * Cross luminance reduction * Cross colour reduction * No chroma trap, therefore sharper vertical luminance transients * Analog discrete-time signal processing, therefore no quantization noise * Anti-aliasing and reconstruction filters are included * Input switch selects between two Y/CVBS inputs * Output switch selects between combed CVBS and an external Y/C source * fSC as well as 2 x fSC colour subcarrier signal may be applied * Alignment free * Few external components * Low power. GENERAL DESCRIPTION TDA9181 The TDA9181 is a an adaptive PAL/NTSC comb filter with two internal delay lines, filters, clock control and input clamps. Video standards PAL B, G, H, D, I, M and N and NTSC M are supported. Two CVBS input signals can be selected by means of an input switch. The selected CVBS input signal is filtered to obtain a combed luminance output signal and a combed chrominance output signal. Switched capacitor circuit techniques are used, requiring an internal clock, locked on to the colour subcarrier frequency. The colour subcarrier frequency as well as twice the colour subcarrier frequency may be applied to the IC. In addition to the comb filter the circuit contains an output switch so that a selection can be made between the combed CVBS signal and an external Y/C signal. The IC is available in a DIP16 and SO16 package. The supply voltage is 5 V. QUICK REFERENCE DATA SYMBOL VCCA ICCA VDDD IDDD Vi(Y/CVBS)(p-p) Vi(CIN)(p-p) Vi(FSC)(p-p) Vo(Y/CVBS)(p-p) Vo(CIN)(p-p) analog supply voltage analog supply current digital supply voltage digital supply current luminance or CVBS input signal voltage (peak-to-peak value) chrominance input signal voltage (peak-to-peak value) colour subcarrier input signal voltage (peak-to-peak value) luminance or CVBS output signal voltage (peak-to-peak value) chrominance output signal voltage (peak-to-peak value) PARAMETER MIN. 4.5 - 4.5 - 0.7 - 100 0.6 - TYP. 5.0 25 5.0 10 1.0 0.7 200 1.0 0.7 MAX. 5.5 - 5.5 - 1.4 1.0 400 1.54 1.1 UNIT V mA V mA V V mV V V ORDERING INFORMATION TYPE NUMBER TDA9181P TDA9181T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-4 SOT162-1 2000 Nov 22 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2000 Nov 22 handbook, full pagewidth BLOCK DIAGRAM Philips Semiconductors Integrated multistandard comb filter VCCA 6 VDDD 5 14 INPSEL Y/CVBS1 2 12 Y/CVBSOUT CLAMP LPF 2H/4H DELAY ADAPTIVE COMB FILTER LPF Y/CVBS2 3 CLAMP LPF TDA9181 1 7 FILTER TUNING (LPFs) 9 4 x fsc CLOCK GENERATOR 16 COUT 3 CIN SC SANDCASTLE DETECTOR 8 11 10 13 4 15 FSC FSCSEL SYS1 SYS2 AGND DGND OUTSEL MGT518 Objective specification TDA9181 Fig.1 Block diagram. Philips Semiconductors Objective specification Integrated multistandard comb filter PINNING SYMBOL CIN INPSEL Y/CVBS2 DGND VDDD VCCA SC FSCSEL FSC SYS2 SYS1 Y/CVBS1 AGND Y/CVBSOUT OUTSEL COUT PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TDA9181 DESCRIPTION chrominance signal input input switch select input luminance or CVBS signal 2 input digital ground digital supply voltage analog supply voltage sandcastle signal input colour subcarrier select input colour subcarrier input signal standard select 2 input standard select 1 input luminance or CVBS signal 1 input analog ground (signal reference) luminance or CVBS signal output output switch select input chrominance signal output handbook, halfpage CIN 1 handbook, halfpage 16 COUT 15 OUTSEL 14 Y/CVBSOUT 13 AGND CIN 1 16 COUT 15 OUTSEL 14 Y/CVBSOUT 13 AGND INPSEL 2 Y/CVBS2 3 DGND 4 INPSEL 2 Y/CVBS2 3 DGND 4 TDA9181P VDDD 5 VCCA 6 SC 7 FSCSEL 8 MGT519 TDA9181T 12 Y/CVBS1 11 SYS1 10 SYS2 9 FSC VDDD 5 VCCA 6 SC 7 FSCSEL 8 MGT520 12 Y/CVBS1 11 SYS1 10 SYS2 9 FSC Fig.2 Pin configuration (DIP16). Fig.3 Pin configuration (SO16). 2000 Nov 22 4 Philips Semiconductors Objective specification Integrated multistandard comb filter FUNCTIONAL DESCRIPTION Input configuration The Y/CVBS1 and Y/CVBS2 input signals are clamped by means of an internally generated clamp pulse which is derived from the sandcastle input signal (pin SC). If no sandcastle signal is available, a clamp pulse signal may be applied to pin SC. External clamp capacitors are needed. The buffered and clamped Y/CVBS1 and Y/CVBS2 signals are then applied to the input switch. The input switch select signal (INPSEL) determines whether Y/CVBS1 or Y/CVBS2 is passed through to the anti-alias low-pass filter. This 3rd-order low-pass filter is optimized for best performance with respect to step response and clock suppression. The filtered signal is sampled at a clock frequency of four times the colour subcarrier frequency (fSC). A colour subcarrier frequency signal is applied to pin FSC. The colour subcarrier select input signal (FSCSEL) indicates whether the colour subcarrier frequency (fSC) or twice the colour subcarrier frequency (2 x fSC) is being applied at the FSC input. An external coupling capacitor is needed for the colour subcarrier input signal. Comb filter The sampled CVBS signal is applied to two delay lines. Depending on the applied standard, one delay line delays the signal over 1 or 2H for NTSC and PAL respectively (1H = one line-time). The standard select inputs SYS1 and SYS2 indicate which standard, PAL B, G, H, D, I, M, N or NTSC M, is being applied. The direct and delayed signals are applied to an adaptive comb filter. The adaptive comb filter performs band-pass filtering around the colour subcarrier frequency and compares the contents of adjacent lines. In this way the combing of signals with different information is prevented and artifacts such as hanging dots are avoided. Both the combed chrominance and the combed luminance signals are passed through a reconstruction low-pass filter to obtain continuous-time signals. These low-pass filters are 3rd-order, optimized for best performance with respect to step response and clock suppression. The reconstructed signals are applied to the output switches. Output configuration TDA9181 The luminance output switch selects between the reconstructed combed luminance signal and one of the buffered and clamped input signals, Y/CVBS1 or Y/CVBS2. The chrominance output switch selects between the reconstructed combed chrominance signal and the chrominance input signal (CIN). An external coupling capacitor is needed for CIN. The selected signals are applied to the outputs Y/CVBSOUT and COUT respectively via a buffer stage. The output switch signal (OUTSEL) determines whether the output switches select the internal combed signals or the external Y/C signals. Clock generation and filter tuning The clock generator is driven by a Phase-Locked Loop (PLL) circuit which generates a reference frequency of four times the colour subcarrier frequency. This PLL circuit is phase-locked to the colour subcarrier input signal (FSC). Several internal clock signals are derived from the 4 x fSC reference. The filter tuning ensures the automatic alignment of the anti-alias and the reconstruction low-pass filters. A 4 x fSC clock signal is used as a reference for the alignment. The tuning takes place each line during the line blanking and is initiated by means of an internally generated signal which is derived from the sandcastle input signal. If the output switches select external Y/C signals the oscillator of the PLL circuit is stopped regardless of the FSC input and no internal clock signals are generated. The filter tuning is also stopped. 2000 Nov 22 5 Philips Semiconductors Objective specification Integrated multistandard comb filter Mode definitions Table 1 General mode definitions; note 1 MODE COMB YC Table 5 FSC mode definitions; note 1 TDA9181 PIN FSCSEL LOW HIGH Note FSC INPUT SIGNAL FREQUENCY fSC 2 x fSC PIN OUTSEL LOW HIGH Note 1. If the OUTSEL pin is left open-circuit, the pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the COMB mode can also be selected by not connecting the OUTSEL pin. Table 2 Y/CVBSOUT output signal definitions MODE COMB YC Table 3 Y/CVBSOUT OUTPUT SIGNAL comb filtered luminance signal Y/CVBS1 or Y/CVBS2 signal COUT output signal definitions MODE COMB YC Table 4 COUT OUTPUT SIGNAL comb filtered chrominance signal CIN signal Input switch mode definitions; note 1 INPUT SWITCH MODE Y/CVBS1 input selected Y/CVBS2 input selected 1. If the FSCSEL pin is left open-circuit, the pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the fSC mode can also be selected by not connecting the FSCSEL pin. Table 6 Video standard mode definitions; note 1 PIN SYS2 LOW HIGH LOW HIGH VIDEO STANDARD PAL M PAL B, G, H, D or I NTSC M PAL N PIN SYS1 LOW LOW HIGH HIGH Note PIN INPSEL LOW HIGH Note 1. If the SYS1 and SYS2 pins are left open-circuit, the SYS1 pin is pulled HIGH by means of an internal pull-up resistor to analog supply (VCCA) and the SYS2 pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the NTSC M video standard can also be selected by not connecting pins SYS1 and SYS2. 1. If the INPSEL pin is left open-circuit, the pin is pulled LOW by means of an internal pull-down resistor to analog ground (AGND). Thus the Y/CVBS1 input can also be selected by not connecting the INPSEL pin. 2000 Nov 22 6 Philips Semiconductors Objective specification Integrated multistandard comb filter LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDDD VCCA Vi(prot)(th) Tstg Tamb Tsol Tj Ves PARAMETER digital supply voltage analog supply voltage input voltage protection threshold storage temperature ambient temperature soldering temperature junction temperature electrostatic handling voltage HBM; all pins, except pins 5 and 6; notes 1, 2 and 3 MM; all pins, except pins 5 and 6; notes 1, 4 and 5 Notes 1. All pins are protected against ESD by means of internal clamping diodes. 2. Human Body Model (HBM): R = 1.5 k; C = 100 pF. 3. Pin 5 (VDDD) and pin 6 (VCCA): HBM: -1500 V < Ves < +1500 V. 4. Machine Model (MM): R = 0 ; C = 200 pF. 5. Pin 5 (VDDD) and pin 6 (VCCA): MM: -150 V < Ves < +150 V. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TDA9181P TDA9181T QUALITY SPECIFICATION In accordance with "SNW-FQ-611E". Latch-up At an ambient temperature of 70 C all pins meet the following specification: * Itrigger 100 mA or 1.5 VDD(max) * Itrigger -100 mA or -0.5 VDD(max). PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 75 95 VALUE for 5 s CONDITIONS - - -0.3 -25 -25 - - -3000 -300 MIN. TDA9181 MAX. 5.5 5.5 VDD + 0.3 +150 +70 260 150 +3000 +300 UNIT V V V C C C C V V UNIT K/W K/W 2000 Nov 22 7 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 CHARACTERISTICS VCCA = VDDD = 5 V; Tamb = 25 C; input signal Y/CVBS1 = 1 V (p-p); input signal Y/CVBS2 = 1 V (p-p); input signal CIN = 0.7 V (p-p); input signal FSC = 200 mV (p-p) sine wave at fSC; input signal SC = 5 V (p-p) sandcastle signal; test signal: 100/0/75/0 EBU colour bar for PAL B, G, H, D, I and N, 100% white 75% amplitude FCC colour bar for NTSC M and PAL M; source impedance for Y/CVBS1 and Y/CVBS2 = 75 , coupled with 10 nF; source impedance for CIN and FSC = 75 , coupled with 100 nF; load impedance for CVBS/YOUT and COUT = 15 pF to analog ground (pin AGND); all voltages are related to analog ground (pin AGND); unless otherwise specified. SYMBOL Supplies VCCA ICCA VDDD IDDD P analog supply voltage analog supply current digital supply voltage digital supply current power dissipation 4.5 - 4.5 - - 5.0 25 5.0 10 175 5.5 - 5.5 - - V mA V mA mW PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Luminance or CVBS input 1 and input 2; pins Y/CVBS1 and Y/CVBS2 Vi(Y/CVBS)(p-p) tclamp(Y/CVBS) Ii(Y/CVBS) luminance or CVBS input voltage (peak-to-peak value) clamp time constant input current during clamping during active video Chrominance input; pin CIN Vi(CIN)(p-p) Ri(CIN) Vi(FSC)(p-p) D Ri(FSC) Vi(SC) tW tW(rep) Ri(SC) Ci(SC) VIL VIH Ri(INPSEL) Ci(INPSEL) 2000 Nov 22 chrominance input voltage (peak-to-peak value) input resistance - 30 0.7 - 200 50 - - - - - - - - - - - 1.0 - 400 60 - 3.3 - - - 2.6 - 2 V k including sync 0.7 - -10 -10 1.0 20 0 0 1.4 - +10 +10 V lines A nA Colour subcarrier input; pin FSC subcarrier input voltage (peak-to-peak value) duty cycle input resistance square wave 100 40 30 - 3.7 2.6 - 1 - Y/CVBS1 selected Y/CVBS2 selected - 2.0 100 - 8 mV % k Sandcastle input; pin SC sandcastle input voltage pulse width pulse rising edge position input resistance input capacitance no clamping clamping clamping; note 1 with respect to end of line-blanking; note 1 V V s s M pF Input switch select input; pin INPSEL LOW-level input voltage HIGH-level input voltage input resistance input capacitance 0.5 - - 2 V V k pF Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 SYMBOL PARAMETER CONDITIONS - MIN. - - - - - - - - - - - - TYP. MAX. UNIT Output switch select input; pin OUTSEL VIL VIH Ri(OUTSEL) Ci(OUTSEL) VIL VIH Ri(FSCSEL) Ci(FSCSEL) VIL VIH Ri(SYS) Ci(SYS) LOW-level input voltage HIGH-level input voltage input resistance input capacitance COMB mode YC mode 0.5 - - 2 V V k pF 2.0 100 - fSC at FSC input; note 2 2 x fSC at FSC input - 2.0 100 - - 2.0 100 - Colour subcarrier select input; pin FSCSEL LOW-level input voltage HIGH-level input voltage input resistance input capacitance 0.5 - - 2 V V k pF Standard select inputs 1 and 2; pins SYS1 and SYS2 LOW-level input voltage HIGH-level input voltage input resistance input capacitance 0.5 - - 2 V V k pF Luminance output; pin Y/CVBSOUT Vo(Y/CVBSOUT)(p-p) EG(Y) B-3dB(Y) luminance output signal (peak-to-peak value) luminance gain error -3 dB luminance bandwidth COMB mode; PAL B, G, H, D and I COMB mode; NTSC M, PAL M and N YC mode td(proc)(Y) luminance processing delay COMB mode; PAL B, G, H, D and I; note 3 COMB mode; NTSC M, PAL M and N; note 3 YC mode Vclamp Ebl S/N ct fCLK(res)(Y) voltage level during clamping black level error luminance signal-to-noise ratio (1 V/Vrms noise) crosstalk between different inputs residues of clock frequencies in the luminance signal (Vrms/1 V) during blanking; note 4 unweighted; 200 kHz to 5 MHz 0 to 5 MHz COMB mode; note 2 f = 4 x fSC f = 2 x fSC f = 1.33 x fSC f = fSC - - - - - - - - -30 -30 -30 -40 dB dB dB dB including sync 0.6 -1 6 5 10 - - - - -10 56 - 1.0 0 - - - 650 800 15 1.5 0 - - 1.54 +1 - - - - - - - +10 - -50 V dB MHz MHz MHz ns ns ns V mV dB dB 2000 Nov 22 9 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 SYMBOL FSCres(YC) PARAMETER FSC residue in YC mode (Vrms/1 V) CONDITIONS f = fSC; fSC at FSC input; note 2 - MIN. - - - TYP. MAX. -60 -60 - UNIT dB dB dB f = 2 x fSC; 2 x fSC at FSC - input ct crosstalk suppression at vertical transient black multi-burst [1 V/V (p-p)] suppression (comb depth) with respect to luminance band-pass nearest to fSC vertical transition active 26 video vertical blanking; Figs 6 and 7; note 5 COMB mode; PAL B, G, H, D and I; note 2 and Fig.8 f = fSC 283.75 - 74 f = ------------------------------ x f SC 283.75 283.75 + 74 f = ------------------------------ x f SC 283.75 COMB mode; PAL M; note 2 and Fig.9 f = fSC 227.25 - 59 f = ------------------------------ x f SC 227.25 227.25 + 59 f = ------------------------------ x f SC 227.25 COMB mode, PAL N; see note 2 and Fig.10 f = fSC 229.25 - 59 f = ------------------------------ x f SC 229.25 229.25 + 59 f = ------------------------------ x f SC 229.25 COMB mode, NTSC M; see note 2 and Fig.11 f = fSC 227.5 - 59 f = -------------------------- x f SC 227.5 227.5 + 59 f = --------------------------- x f SC 227.5 Ro ZL output resistance load impedance 30 - - - - 30 - - 30 - - 30 - - SUPcomb(Y) - 10 10 - - - dB dB dB - 10 10 - - - dB dB dB - 10 10 - - - dB dB dB - 10 10 - - - - - 500 15 dB dB dB pF 2000 Nov 22 10 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 SYMBOL PARAMETER CONDITIONS - MIN. TYP. MAX. UNIT Chrominance output; pin COUT Vo(COUT)(p-p) EG(chrom) B-3dB(chrom) chrominance output signal (peak-to-peak value) chrominance gain error -3 dB chrominance bandwidth difference with luminance processing delay DC voltage level chrominance signal-to-noise ratio (0.7 V/Vrms noise) crosstalk between different inputs residues of clock frequencies in the chrominance signal (Vrms/0.7 V) unweighted; fSC 0.3fSC; note 2 0 to 5 MHz COMB mode; note 2 f = 4 x fSC f = 2 x fSC f = 1.33 x fSC f = fSC FSCres(YC) FSC residue in YC mode (Vrms/0.7 V) f = fSC; fSC at FSC input; note 2 - - - - - - - - - - - - -30 -30 -40 -50 -60 -60 - dB dB dB dB dB dB dB 0.7 0 - - 0 1.5 - - 1.1 +1 - - 20 - - -50 V dB MHz MHz ns V dB dB -1 COMB mode, around fSC; 1.5 note 2 YC mode; base-band 10 - - 56 - t(proc)(Y) VDC S/Nchrom ct fclk(res)(chrom) f = 2 x fSC; 2 x fSC at FSC - input ct crosstalk suppression at vertical transient no-colour colour [0.7 V/V (p-p)] vertical transition active 26 video vertical blanking; see Figs 6 and 7 and note 6 2000 Nov 22 11 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 SYMBOL SUPcomb(chrom) PARAMETER suppression (comb depth) with respect to chrominance band-pass at f = fSC CONDITIONS COMB mode; PAL B, G, H, D and I; note 2 and Fig.12 284 f = ----------------- x f SC 283.75 284 - 74 f = --------------------- x f SC 283.75 284 + 74 f = ---------------------- x f SC 283.75 COMB mode; PAL M; see note 2 and Fig.13 227 f = ----------------- x f SC 227.25 227 - 59 f = --------------------- x f SC 227.25 227 + 59 f = ---------------------- x f SC 227.25 COMB mode; PAL N; see note 2 and Fig.14 229 f = ----------------- x f SC 229.25 229 - 59 f = --------------------- x f SC 229.25 229 + 59 f = ---------------------- x f SC 229.25 COMB mode; NTSC M; see note 2 and Fig.15 227 f = -------------- x f SC 227.5 227 - 59 f = --------------------- x f SC 227.5 227 + 59 f = ---------------------- x f SC 227.5 MIN. TYP. MAX. UNIT 30 30 30 - - - - - - dB dB dB 30 30 30 - - - - - - dB dB dB 30 30 30 - - - - - - dB dB dB 30 30 30 - - - - - - - - - - 500 15 dB dB dB pF Ro ZL output resistance load impedance 2000 Nov 22 12 Philips Semiconductors Objective specification Integrated multistandard comb filter Notes TDA9181 1. The pulse should fall inside the line-blanking interval, after the rising edge of the synchronizing pulse. 2. fSC = colour subcarrier frequency; fSC = 4.43361875 MHz for the PAL B, G, H, D and I systems; fSC = 3.57561149 MHz for the PAL M system; fSC = 3.58205625 MHz for the PAL N system; fSC = 3.579545 MHz for the NTSC M system. 3. For PAL B, G, H, D and I: with respect to 567.5 colour subcarrier periods (equals 128.00 s) due to 2H delay in the comb filter. For PAL M: with respect to 454.5 colour subcarrier periods (equals 127.11 s) due to 2H delay in the comb filter. For PAL N: with respect to 458.5 colour subcarrier periods (equals 128.00 s) due to 2H delay in the comb filter. For NTSC M: with respect to 227.5 colour subcarrier periods (equals 63.556 s) due to 1H delay in the comb filter. 4. With respect to the voltage level during clamping. 5. Test signal for PAL B, G, H, D, I and N: CCIR-18 multi-burst (see Fig.4). For PAL M and NTSC M: 100% amplitude FCC multi-burst (see Fig.5). 6. Test signal for PAL B, G, H, D, I and N: 100/0/75/0 EBU colour bar. For PAL M and NTSC M: 100% white 75% amplitude FCC colour bar. handbook, full pagewidth 1 (V) 0.86 0.5 1.0 2.0 3.8 4.8 5.8 MHz 0.65 0.45 0.44 0.30 0.15 0 MGT521 Fig.4 CCIR-18 multi-burst. 2000 Nov 22 13 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 (V) 0.5 1.5 2.0 3.0 3.58 4.1 MHz 0.65 0.45 0.30 0.15 0 MGT522 Fig.5 100% amplitude FCC multi-burst. 2000 Nov 22 14 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth input line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 output line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 crosstalk crosstalk Transition at top of field input line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 output line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 crosstalk Transition at bottom of field crosstalk MGT523 Fig.6 Vertical transitions active video vertical blanking from line to line (PAL systems). handbook, full pagewidth input line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 output line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 crosstalk Transition at top of field input line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 output line n - 2 line n - 1 line n line n + 1 line n + 2 line n + 3 crosstalk Transition at bottom of field MGT524 Fig.7 Vertical transitions active video vertical blanking from line to line (NTSC system). 2000 Nov 22 15 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = f SC Y 1 Y 0.5 U V U V U 0 282.75 f 283.75 SC 283 f 283.75 SC 283.25 f 283.75 SC 283.5 f 283.75 SC 283.75 f 283.75 SC 284 f 283.75 SC 284.25 f 283.75 SC 284.5 f 283.75 SC 284.75 f 283.75 SC MGT525 Fig.8 Luminance transfer characteristic (PAL B, G, H, D and I systems). 2000 Nov 22 16 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = f SC Y 1 Y 0.5 U V U V U 0 226.25 f 227.25 SC 226.5 f 227.25 SC 226.75 f 227.25 SC 227 f 227.25 SC 227.25 f 227.25 SC 227.5 f 227.25 SC 227.75 f 227.25 SC 228 f 227.25 SC 228.25 f 227.25 SC MGT526 Fig.9 Luminance transfer characteristic (PAL M system). 2000 Nov 22 17 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = f SC Y 1 Y 0.5 U V U V U 0 228.25 f 229.25 SC 228.5 f 229.25 SC 228.75 f 229.25 SC 229 f 229.25 SC 229.25 f 229.25 SC 229.5 f 229.25 SC 229.75 f 229.25 SC 230 f 229.25 SC 230.25 f 229.25 SC MGT527 Fig.10 Luminance transfer characteristic (PAL N system). 2000 Nov 22 18 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = f SC Y 1 Y Y Y 0.5 C C C C C 0 225.5 f 227.5 SC 226 f 227.5 SC 226.5 f 227.5 SC 227 f 227.5 SC 227.5 f 227.5 SC 228 f 227.5 SC 228.5 f 227.5 SC 229 f 227.5 SC 229.5 f 227.5 SC MGT528 Fig.11 Luminance transfer characteristic (NTSC M system). 2000 Nov 22 19 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = U 1 V U V 284 f 283.75 SC 0.5 U Y Y 0 282.75 f 283.75 SC 283 f 283.75 SC 283.25 f 283.75 SC 283.5 f 283.75 SC 283.75 f 283.75 SC 284 f 283.75 SC 284.25 f 283.75 SC 284.5 f 283.75 SC MGT529 Fig.12 Chrominance transfer characteristic (PAL B, G, D, H and I systems). 2000 Nov 22 20 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view 227 f comb depth at f = 227.25 SC U 1 V U V 0.5 Y Y 0 226.25 f 227.25 SC 226.5 f 227.25 SC 226.75 f 227.25 SC 227 f 227.25 SC 227.25 f 227.25 SC 227.5 f 227.25 SC 227.75 f 227.25 SC 228 f 227.25 SC MGT530 Fig.13 Chrominance transfer characteristic (PAL M system). 2000 Nov 22 21 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = U 1 229 f 229.25 SC V U V 0.5 Y Y 0 228.25 f 229.25 SC 228.5 f 229.25 SC 228.75 f 229.25 SC 229 f 229.25 SC 229.25 f 229.25 SC 229.5 f 229.25 SC 229.75 f 229.25 SC 230 f 229.25 SC MGT531 Fig.14 Chrominance transfer characteristic (PAL N system). 2000 Nov 22 22 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 handbook, full pagewidth 1 0.5 0 0 1 x f SC 2 x f SC Detailed view comb depth at f = C 1 227 f 227.5 SC C C C 0.5 Y Y Y Y 0 225.5 f 227.5 SC 226 f 227.5 SC 226.5 f 227.5 SC 227 f 227.5 SC 227.5 f 227.5 SC 228 f 227.5 SC 228.5 f 227.5 SC 229 f 227.5 SC MGT532 Fig.15 Chrominance transfer characteristic (NTSC M system). 2000 Nov 22 23 Philips Semiconductors Objective specification Integrated multistandard comb filter APPLICATION INFORMATION TDA9181 handbook, full pagewidth C1 CIN 100 nF INPSEL C3 Y/CVBS2 L5 220 H 10 nF C4 100 nF 5 L6 5V 220 H SC FSCSEL C6 100 nF 6 7 8 11 10 C9 9 100 nF FSC 3 4 14 13 Y/CVBSOUT 2 15 1 16 COUT OUTSEL TDA9181 12 C12 Y/CVBS1 10 nF SYS1 SYS2 MGT533 Fig.16 Application diagram. 2000 Nov 22 24 Philips Semiconductors Objective specification Integrated multistandard comb filter PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil) TDA9181 SOT38-4 D seating plane ME A2 A L A1 c Z e b1 b 16 9 b2 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 2000 Nov 22 25 Philips Semiconductors Objective specification Integrated multistandard comb filter TDA9181 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013 EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 8o 0o ISSUE DATE 97-05-22 99-12-27 2000 Nov 22 26 Philips Semiconductors Objective specification Integrated multistandard comb filter SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. TDA9181 Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 27 2000 Nov 22 Philips Semiconductors Objective specification Integrated multistandard comb filter Suitability of IC packages for wave, reflow and dipping soldering methods TDA9181 SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - - 2000 Nov 22 28 Philips Semiconductors Objective specification Integrated multistandard comb filter DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1) TDA9181 This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Preliminary specification Qualification Product specification Production Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2000 Nov 22 29 Philips Semiconductors Objective specification Integrated multistandard comb filter NOTES TDA9181 2000 Nov 22 30 Philips Semiconductors Objective specification Integrated multistandard comb filter NOTES TDA9181 2000 Nov 22 31 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000 Internet: http://www.semiconductors.philips.com SCA 70 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/25/01/pp32 Date of release: 2000 Nov 22 Document order number: 9397 750 07313 |
Price & Availability of TDA9181
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |